Difference between revisions of "G10 Epoxy Sheet"
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== Description == | == Description == | ||
| − | brand name | + | A brand name for a composition material of glass fiber and resin lamination . “G” stands for glass fiber “10” mean that glass fiber is accounting for 10% of it. G10 material has the features of insulation,wear resistance and corrosion resistance well.Compared with ordinary glass fiber, epoxy glass fiber has excellent properties such as high tensile strength, high elastic modulus, good impact resistance, good chemical stability, good fatigue resistance, high temperature resistance, etc. It is mostly used in chemical industry,aerospace, construction , agriculture,aviation and other aspects. |
| − | == | + | The molecular structure of G10 material consist by reactive epoxy groups, so they can be cross-linked with different kinds of curing agents so as to create insoluble polymers with a network structure three ways .Epoxy resins generally allude to organic polymer mixtures including two or more epoxy bunching in the molecule. with the exception of a few of them, their comparative molecular mass is low. |
| + | |||
| + | G10 and FR4 glass cloth reinforced epoxy natural is typically a yellowish to light green color. The most versatile all-around laminate grades are continuous glass woven fabric impregnated with an epoxy resin binder. Epoxy resins are among the most versatile and widely used plastics in the electronics field, primarily because water absorption is virtually nil, rendering it an outstanding insulator. | ||
| + | |||
| + | Beyond its electrical insulating properties, epoxy resins exhibit great dimensional stability (shrinkage is usually less than 1 percent) and superior adhesive properties. G10/FR4 has extremely high mechanical strength, good dielectric loss properties, and good electric strength properties, both wet and dry. | ||
| + | |||
| + | The main difference between NEMA Grades G10 and FR4 is that FR4 is a fire retardant grade of G10. Therefore, FR4 can be safely substituted where G10 is called for, while G10 can never be substituted where FR4 is called for. G10 meets MIL-I-24768/2 GEE and FR4 meets MIL-I-24768/27 GEE-F. | ||
| + | |||
| + | G9 has good mechanical properties plus high resistance to flame, heat, arcing, and most strong alkali solutions. It is recommended for use where good mechanical properties are needed under wet conditions. Specification: MIL-1-24768/1, Type GME | ||
| + | |||
| + | Options: | ||
| + | * G9: g | ||
| + | * G10: | ||
| + | * G10 Fr4 | ||
| + | * G11: | ||
| + | |||
| + | Low contractibility rate. How react of the epoxy resin and its curing materials used?It is finished by direct addition reaction or open loop polymerization of epoxy catalogs in the resin molecule, but no releasing of water or other volatile side product.Comparing to unsaturated polyester resins and phenolic resins its shrinkage is less than 2% during curing. | ||
| + | |||
| + | G10 Technical Parameter: | ||
| + | Flame Retardant: HB. | ||
| + | Perpendicular layer bending strength (normal): ≥340Mpa. | ||
| + | Perpendicular layer bending strength (150±2℃): ≥340Mpa. | ||
| + | Parallel layer impact strength : 66.7KJ/m². | ||
| + | Parallel layer impact strength :45.3KJ/m². | ||
| + | Insulation resistance after immersion in water (D-24/23): ≥5.0×10²Ω. | ||
| + | Vertical layer-wise electrical strength : ≥10.7MV/m. | ||
| + | Parallel layer breakdown voltage: ≥40KV. | ||
| + | Relative dielectric constant (1MHz): ≤5.5. | ||
| + | Dielectric loss angle: 3.3*10-2. | ||
| + | Water absorption (D-24/23, plate thickness 1.6mm): 6.5mg. | ||
| + | Comparative analysis of epoxy board G10 and G11. | ||
| + | G10 and G11 are laminated composites of glass fiber and resin. G stands for glass fiber, and the number refers to the content of glass fiber in it. | ||
| + | |||
| + | G10 epoxy board: Its color is aqua green, and it is made by dipping E-glass fiber cloth with epoxy resin and pressing it. Because E-glass fiber cloth does not contain halogen elements, it will not pollute the environment. Its glass transition temperature is 130 ℃ and the electric breakdown voltage is greater than 60kv, and it is mostly used to manufacture switchgear, transformers, and explosion-proof electrical appliances. | ||
| + | G11 epoxy board: G11 epoxy board is a hard insulating material, its heat resistance is very good, the glass transition temperature is 175 degrees Celsius, the commonly used size is 1020mm × 1220mm, it is resistant to water, and can be used in humid environments. Mainly used to manufacture high voltage switches. | ||
| + | |||
| + | Contrast of composition- | ||
| + | Composition of G10 epoxy plate: It is composed of hot pressing with imported electronic alkali free glass fiber cloth impregnated with imported epoxy resin and corresponding imported flame retardant, adhesive and other additives. | ||
| + | Composition of G11 epoxy plate: the imported electronic grade alkali free glass fiber cloth is used to impregnate the imported epoxy resin, and the corresponding imported flame retardant, adhesive and other additives are added by hot pressing. Processed paperboard like insulating material. | ||
| + | |||
| + | Performance contrast- | ||
| + | G10 epoxy plate performance:flame retardant ul94-vo, high temperature mechanical properties, good processability and insulation performance. | ||
| + | G11 epoxy plate performance: same as G10 epoxy plate. | ||
| + | |||
| + | Application contrast- | ||
| + | Application of G10 epoxy plate: it is used as insulation composition construction in motors and electrical facility, such as switchgear,circuit breakers,transformers,AC contactors,DC motors, electric facilities of explosion-proof and so on. | ||
| + | Application of G11 epoxy plate: it is used as insulation composition construction in motors and electrical facility, such as used in insulation oil,humid environment, high voltage GIS, high voltage switches and so on. | ||
| + | |||
| + | Comparative analysis of epoxy board G10 and FR4 | ||
| + | FR4 and G10 are high-pressure industrial plates by making use of glass fabric impregnated with epoxy resin. | ||
| + | The difference between FR4 and G10 is in the resin. | ||
| + | The epoxy resin is a composite of two chemicals: epichlorohydrin and “bis” phenol A. | ||
| + | In FR4, a small part of “bis” phenol A is replaced with tetrabromo “bis” phenol A. | ||
| + | The purpose of this replacement is to make the resulting laminate more flame retardant hence the name FR (Flame-Retardant) 4. | ||
| + | There is very little difference in properties. Bromine with its slightly more complex structure is more stable when heat is applied, yet the “tg” (temperature when thermo decomposition is noted)remains relatively the same. | ||
| + | The advantages of G10 epoxy substrates? | ||
| + | Diversified forms. A wide variety of resins, modifier systems and curing agents are available to meet the shape requirements of almost any application, from very low viscosity to high melting solids. | ||
| + | |||
| + | Easy to solidify. The epoxy resin system can be cured almost in the temperature from 0 °C to 180 °C,by using a variety of different curing materials. Of course, in a specific high temperature use environment, we still recommend using high TG materials to produce High TG PCBs. | ||
| + | |||
| + | Strong adhesive force. It have high adhesion to various materials because of polar hydroxyl and ether bonds inherent from epoxy resin existence of molecular chain . Epoxy resins with features of low shrinkage while being cured and creating little internal stress, which also helps to improve bond strength. | ||
| + | ==Resources and Citations== | ||
* Conservation Support Systems, Catalog, 1997 | * Conservation Support Systems, Catalog, 1997 | ||
| − | + | * JHDPCB: [https://jhdpcb.com/what-is-g10-epoxy-sheet-its-features/ G10 Epoxy] | |
| + | * EPlastics: [https://www.eplastics.com/fiberglass/sheets/g10-fr4-epoxy G10-Fr4] | ||
[[Category:Materials database]] | [[Category:Materials database]] | ||
Revision as of 14:04, 26 August 2022
Description
A brand name for a composition material of glass fiber and resin lamination . “G” stands for glass fiber “10” mean that glass fiber is accounting for 10% of it. G10 material has the features of insulation,wear resistance and corrosion resistance well.Compared with ordinary glass fiber, epoxy glass fiber has excellent properties such as high tensile strength, high elastic modulus, good impact resistance, good chemical stability, good fatigue resistance, high temperature resistance, etc. It is mostly used in chemical industry,aerospace, construction , agriculture,aviation and other aspects.
The molecular structure of G10 material consist by reactive epoxy groups, so they can be cross-linked with different kinds of curing agents so as to create insoluble polymers with a network structure three ways .Epoxy resins generally allude to organic polymer mixtures including two or more epoxy bunching in the molecule. with the exception of a few of them, their comparative molecular mass is low.
G10 and FR4 glass cloth reinforced epoxy natural is typically a yellowish to light green color. The most versatile all-around laminate grades are continuous glass woven fabric impregnated with an epoxy resin binder. Epoxy resins are among the most versatile and widely used plastics in the electronics field, primarily because water absorption is virtually nil, rendering it an outstanding insulator.
Beyond its electrical insulating properties, epoxy resins exhibit great dimensional stability (shrinkage is usually less than 1 percent) and superior adhesive properties. G10/FR4 has extremely high mechanical strength, good dielectric loss properties, and good electric strength properties, both wet and dry.
The main difference between NEMA Grades G10 and FR4 is that FR4 is a fire retardant grade of G10. Therefore, FR4 can be safely substituted where G10 is called for, while G10 can never be substituted where FR4 is called for. G10 meets MIL-I-24768/2 GEE and FR4 meets MIL-I-24768/27 GEE-F.
G9 has good mechanical properties plus high resistance to flame, heat, arcing, and most strong alkali solutions. It is recommended for use where good mechanical properties are needed under wet conditions. Specification: MIL-1-24768/1, Type GME
Options:
- G9: g
- G10:
- G10 Fr4
- G11:
Low contractibility rate. How react of the epoxy resin and its curing materials used?It is finished by direct addition reaction or open loop polymerization of epoxy catalogs in the resin molecule, but no releasing of water or other volatile side product.Comparing to unsaturated polyester resins and phenolic resins its shrinkage is less than 2% during curing.
G10 Technical Parameter: Flame Retardant: HB. Perpendicular layer bending strength (normal): ≥340Mpa. Perpendicular layer bending strength (150±2℃): ≥340Mpa. Parallel layer impact strength : 66.7KJ/m². Parallel layer impact strength :45.3KJ/m². Insulation resistance after immersion in water (D-24/23): ≥5.0×10²Ω. Vertical layer-wise electrical strength : ≥10.7MV/m. Parallel layer breakdown voltage: ≥40KV. Relative dielectric constant (1MHz): ≤5.5. Dielectric loss angle: 3.3*10-2. Water absorption (D-24/23, plate thickness 1.6mm): 6.5mg. Comparative analysis of epoxy board G10 and G11. G10 and G11 are laminated composites of glass fiber and resin. G stands for glass fiber, and the number refers to the content of glass fiber in it.
G10 epoxy board: Its color is aqua green, and it is made by dipping E-glass fiber cloth with epoxy resin and pressing it. Because E-glass fiber cloth does not contain halogen elements, it will not pollute the environment. Its glass transition temperature is 130 ℃ and the electric breakdown voltage is greater than 60kv, and it is mostly used to manufacture switchgear, transformers, and explosion-proof electrical appliances. G11 epoxy board: G11 epoxy board is a hard insulating material, its heat resistance is very good, the glass transition temperature is 175 degrees Celsius, the commonly used size is 1020mm × 1220mm, it is resistant to water, and can be used in humid environments. Mainly used to manufacture high voltage switches.
Contrast of composition- Composition of G10 epoxy plate: It is composed of hot pressing with imported electronic alkali free glass fiber cloth impregnated with imported epoxy resin and corresponding imported flame retardant, adhesive and other additives. Composition of G11 epoxy plate: the imported electronic grade alkali free glass fiber cloth is used to impregnate the imported epoxy resin, and the corresponding imported flame retardant, adhesive and other additives are added by hot pressing. Processed paperboard like insulating material.
Performance contrast- G10 epoxy plate performance:flame retardant ul94-vo, high temperature mechanical properties, good processability and insulation performance. G11 epoxy plate performance: same as G10 epoxy plate.
Application contrast- Application of G10 epoxy plate: it is used as insulation composition construction in motors and electrical facility, such as switchgear,circuit breakers,transformers,AC contactors,DC motors, electric facilities of explosion-proof and so on. Application of G11 epoxy plate: it is used as insulation composition construction in motors and electrical facility, such as used in insulation oil,humid environment, high voltage GIS, high voltage switches and so on.
Comparative analysis of epoxy board G10 and FR4 FR4 and G10 are high-pressure industrial plates by making use of glass fabric impregnated with epoxy resin. The difference between FR4 and G10 is in the resin. The epoxy resin is a composite of two chemicals: epichlorohydrin and “bis” phenol A. In FR4, a small part of “bis” phenol A is replaced with tetrabromo “bis” phenol A. The purpose of this replacement is to make the resulting laminate more flame retardant hence the name FR (Flame-Retardant) 4. There is very little difference in properties. Bromine with its slightly more complex structure is more stable when heat is applied, yet the “tg” (temperature when thermo decomposition is noted)remains relatively the same. The advantages of G10 epoxy substrates? Diversified forms. A wide variety of resins, modifier systems and curing agents are available to meet the shape requirements of almost any application, from very low viscosity to high melting solids.
Easy to solidify. The epoxy resin system can be cured almost in the temperature from 0 °C to 180 °C,by using a variety of different curing materials. Of course, in a specific high temperature use environment, we still recommend using high TG materials to produce High TG PCBs.
Strong adhesive force. It have high adhesion to various materials because of polar hydroxyl and ether bonds inherent from epoxy resin existence of molecular chain . Epoxy resins with features of low shrinkage while being cured and creating little internal stress, which also helps to improve bond strength.
Resources and Citations
- Conservation Support Systems, Catalog, 1997